In 2025, Apple is planning to debut a thinner model of the iPhone that might be bought alongside the iPhone 17, iPhone 17 Professional, and iPhone 17 Professional Max. This iPhone 17 “Air” might be about two millimeters thinner than the present iPhone 16 Professional, in line with Bloomberg‘s Mark Gurman.

The iPhone 16 Professional is 8.25mm thick, so an iPhone 17 that’s 2mm thinner would are available in at round 6.25mm. At 6.25mm, the iPhone 17 Air can be Apple’s thinnest iPhone thus far. The thinnest iPhone we have seen to date was the iPhone 6, which measured in at 6.9mm. iPhones bought thicker with the iPhone X and past, as Apple elevated thickness to offer more room for the battery, digital camera lenses, Face ID {hardware}, and extra.
Apple will equip the iPhone 17 Air with its personal custom-designed 5G modem chip, and that chip is smaller than 5G modem chips from Qualcomm. Gurman says that Apple targeted on making the chip extra built-in with different Apple-designed elements to avoid wasting area inside the iPhone, and that area financial savings is what allowed it to create the slimmed down iPhone 17 Air with out sacrificing battery life, the digital camera, or the show high quality.
Prior rumors have additionally urged that the iPhone 17 Air might be someplace between 5mm and 6mm thick, and the ~6mm thickness has now been proposed by a number of dependable sources. The iPhone 17 Air is anticipated to have a show that is round 6.6 inches in measurement, and it’ll additionally characteristic a single-lens rear digital camera.
The iPhone 17 Air might be one in all three gadgets which are set to get a {custom} Apple modem chip in 2025, with Apple additionally bringing the chip to the iPhone SE early within the yr and a low-cost iPad.
As Apple improves its modem chip design, the saved area might permit for “new designs” equivalent to a foldable iPhone. In response to Gurman, Apple is continuous to discover foldable iPhone know-how. Apple is aiming to part out Qualcomm modems throughout a three-year interval as Apple introduces more and more extra highly effective modem chips.
Finally, Apple might debut a system-on-a-chip that features a processor, modem, Wi-Fi chip, and different elements, which might save further area and permit for tighter integration between {hardware} elements.
