Parallel piezo aligners with fly top sensors allow quicker PIC wafer testing.
Parallel miniaturized piezoelectric alignment engines with fly-height sensors allow quicker PIC wafer testing. Picture Credit score: PI (Physik Instrumente) LP
PI (Physik Instrumente) introduced a brand new know-how platform for electro-optical wafer-level testing designed to validate electrical and optical machine capabilities concurrently in high-volume manufacturing. The system combines high-density electrical probing with automated photonic alignment in a compact structure constructed for ATE compatibility.
Parallel Operation and Scalability
Designed for manufacturing scale, the platform helps parallel operation of a number of miniaturized alignment engines throughout a single wafer, enabling simultaneous electro-optical probing at a number of take a look at websites to extend throughput and decrease value of take a look at. Its compact, ATE-compatible structure is meant to make it sensible to deploy many aligners in a single setup – serving to EPIC producers transition from sequential, lab-style alignment to high-volume, repeatable wafer-level testing.
A key new characteristic is FAU ranging, an interferometry-based fly-height measurement technique that makes use of current fiber channels – including no further {hardware} and no further footprint – to measure fiber-to-wafer distance at the focus, supporting steady probing and repeatable optical coupling. PI notes that FAU ranging also can allow future approaches comparable to trench-based photonic edge coupling, serving to save wafer actual property and cut back machine prices.
“With FAU ranging, we pave the way in which for trench-based photonic edge coupling, saving wafer actual property, decreasing machine prices, and unlocking new design freedom for EPIC producers.” Dr. Markus Simon, Strategic Innovation and Know-how Administration at PI.
PI will current the platform at SPIE Photonics West 2026.
Industries Served
Photonics, electro-optical wafer testing
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