- Revealed: January 2024.
- Pages: 330
- Tables: 22
- Figures: 25
- Sequence: Electronics
The worldwide panorama of semiconductor manufacturing is quickly evolving, with superior packaging rising as a crucial element of producing and design. It impacts energy, efficiency, and value on a macro stage, and the essential performance of all chips on a micro stage. Superior packaging permits for the creation of quicker, cost-effective methods by integrating numerous chips, a way that is more and more important given the bodily limitations of conventional chip miniaturization. It is reshaping the trade, enabling the combination of numerous chip varieties and enhancing processing speeds.
The U.S. authorities acknowledges the significance of superior packaging and has launched a $3 billion Nationwide Superior Packaging Manufacturing Program aimed toward establishing high-volume packaging services by the tip of the last decade. The deal with packaging enhances the prevailing efforts beneath the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.
The World Marketplace for Superior Semiconductor Packaging 2024-2035 offers a complete evaluation of the worldwide superior semiconductor packaging applied sciences market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values within the billions (USD) by kind, area, and end-use utility.
Tendencies analyzed embody heterogeneous integration, interconnects, thermal options, miniaturization, provide chain maturity, simulation/knowledge analytics. Main corporations profiled embody TSMC, Samsung, Intel, JCET, Amkor. Functions coated embody AI, cell, automotive, aerospace, IoT, communications (5G/6G), excessive efficiency computing, medical, and shopper electronics.
Regional markets explored embody North America, Asia Pacific, Europe, China, Japan, and RoW. The report additionally assesses drivers like ML/AI, knowledge facilities, EV/ADAS; challenges like prices, complexity, reliability; rising approaches like system-in-package, monolithic 3D ICs, superior substrates, novel supplies. General an in-depth benchmark evaluation of the alternatives inside the advancing semiconductor packaging trade.
Report contents embody:
- Market measurement and forecasts
- Key know-how tendencies
- Progress drivers and challenges
- Aggressive panorama evaluation
- Future packaging tendencies outlook
- In-depth evaluation of wafer stage packaging (WLP)
- System-in-Package deal (SiP) and heterogeneous integration
- Monolithic 3D ICs overview
- Superior semiconductor packaging purposes throughout key markets: AI, cell, automotive, aerospace, IoT, communications, HPC, medical, shopper electronics
- Regional market breakdown
- Evaluation of key trade challenges: complexity, prices, provide chain maturity, requirements
- Firm profiles: Methods and applied sciences of 90 key gamers. Corporations profiled embody 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Company, Chief-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Field, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Firm (TSMC) and Yuehai Built-in.
The World Marketplace for Superior Semiconductor Packaging 2024-2035
PDF obtain/by e-mail.
The World Marketplace for Superior Semiconductor Packaging 2024-2035
PDF and print version (together with tracked FEDEX supply).
Fee strategies: Visa, Mastercard, American Specific, Paypal, Financial institution Switch.
To buy by bill (financial institution switch) contact data@futuremarketsinc.com or choose Financial institution Switch (Bill) as a fee technique at checkout.